Introduction to PCB Stencils PCB stencils are an essential tool in the electronics manufacturing industry. They are used to apply solder paste onto printed circuit boards (PCBs) before components are placed and soldered. This process ensures precise and consistent solder paste application, which is crucial for the proper functioning of the electronic device. What is […]
Composition-Based Solder Types The most common types of solder, based on their composition, include: Lead-Based Solder Lead-based solders contain lead (Pb) as the primary component, along with tin (Sn) and sometimes other elements. The most common lead-based solder is 63/37 (63% tin, 37% lead), known for its low melting point and excellent wetting properties. However, […]
What to Look for in a PCB Manufacturer When evaluating PCB Manufacturers, there are several key factors to consider: Capabilities – What types of PCBs can they manufacture? This includes things like max number of layers, material options, min trace/space widths, hole sizes, surface finishes, etc. Pricing – How competitive are their prices, especially for […]
What are Castellated Pads? Castellated pads, also known as castellated holes or castellations, are a type of surface mount technology (SMT) used in printed circuit board (PCB) design. These pads are essentially plated through-holes (PTHs) that are cut in half along the edge of the PCB, creating a series of semi-circular pads that resemble the […]
What are PCB pads? PCB pads, also known as solder pads or landing pads, are conductive areas on a printed circuit board where electronic components are soldered. These pads provide a surface for the component leads or pins to be attached, enabling electrical connectivity between the component and the PCB traces. Key Features of PCB […]
What is PCB tombstoning? PCB tombstoning, also known as chip lifting or Manhattan effect, is a defect that occurs during the reflow soldering process of surface mount components on printed circuit boards (PCBs). It is characterized by one end of a component lifting off the pad, while the other end remains soldered, resulting in a […]
Introduction to PCB Pads PCB pads, also known as land patterns or footprints, are the exposed metal surfaces on a printed circuit board (PCB) where electronic components are soldered. They provide electrical and mechanical connections between the component leads and the copper traces on the PCB. Pads come in various shapes, sizes, and configurations to […]
Leading Electronics Manufacturing Services Provider Expands BGA Rework Services Rocket EMS, a top provider of electronics manufacturing services, has announced the addition of large BGA (ball grid array) rework capability to its service offerings. This expansion allows Rocket EMS to perform complex rework on PCBs with large BGA components, meeting the evolving needs of its […]
What is BGA Assembly? Ball Grid Array (BGA) assembly is a high-density packaging technology used in the manufacturing of electronic devices. BGA assemblies consist of a substrate with a grid of solder balls on the bottom surface, which are used to connect the package to a printed circuit board (PCB). This packaging method allows for […]
Introduction to Micro-BGA PCB Assembly Micro-BGA (Ball Grid Array) is a type of surface-mount packaging used for integrated circuits (ICs) with a high pin count and small footprint. This packaging technology has gained popularity in recent years due to the increasing demand for miniaturization and high-density interconnects in electronic devices. Micro-BGA PCB assembly requires specialized […]
