Services / PROTOTYPE PCB ASSEMBLY
BGA Assembly Review
Resolve package, board and inspection requirements before committing a BGA design to production.
Package and land pattern
Provide the exact package drawing and manufacturer part number. Identify pad, via and escape-routing features that need fabrication and assembly review.
Process requirements
Flag moisture handling requirements and temperature limitations from the component documentation. Confirm the intended assembly sequence for both sides of the board.
Inspection scope
Hidden solder joints may need a dedicated inspection approach. Discuss X-ray availability and scope for your project instead of assuming every inspection method is included.