Services / PROTOTYPE PCB ASSEMBLY
Multilayer PCB Review
Align layer structure, material and electrical requirements before fabrication.
Document your stackup
Provide the intended layer order, signal and plane functions, finished thickness and material requirements. State which dimensions are design requirements and which may be proposed by fabrication.
Electrical priorities
Flag controlled impedance nets and any transmission-line requirements. Agree on the stackup and verification approach before the design is released.
Fabrication data
Include drills, board outline and special via requirements with the fabrication package. Resolve discrepancies between drawings and fabrication exports before ordering.