Rocket EMS Adds Large BGA Rework Capability

Leading Electronics Manufacturing Services Provider Expands BGA Rework Services

Rocket EMS, a top provider of electronics manufacturing services, has announced the addition of large BGA (ball grid array) rework capability to its service offerings. This expansion allows Rocket EMS to perform complex rework on PCBs with large BGA components, meeting the evolving needs of its customers in the aerospace, defense, medical, and industrial sectors.

What is BGA Rework?

BGA rework involves removing and replacing BGA components on a printed circuit board (PCB). BGA components are surface-mount devices with an array of solder balls on the bottom, which are used to attach the component to the PCB. BGA packages offer several advantages, including:

• High interconnect density
• Excellent electrical and thermal performance
• Small footprint
• Reduced lead inductance

However, BGA components can be challenging to rework due to their high pin count, small pitch, and hidden solder joints. Specialized equipment, skilled technicians, and precise processes are required to perform BGA rework successfully.

Why is Large BGA Rework Capability Important?

As electronic devices become more complex and miniaturized, the use of large BGA components has increased significantly. These components, which can have thousands of solder balls and pitches as small as 0.3mm, are commonly found in high-performance applications such as:

• System-on-chip (SoC) devices
• Field-programmable gate arrays (FPGAs)
• Application-specific integrated circuits (ASICs)
• Graphics processing units (GPUs)

The ability to rework large BGA components is crucial for several reasons:

1. Product development and prototyping: During the product development phase, design changes and component replacements are often necessary. Large BGA rework capability allows for quick modifications without scrapping entire PCBs.

2. Manufacturing defect repair: Despite stringent quality control measures, manufacturing defects can occur. BGA rework enables the repair of defective boards, reducing scrap and improving yield.

3. Field failure repair: When electronic devices fail in the field, BGA rework can be used to replace faulty components, extending the life of the product and minimizing downtime.

4. Obsolescence management: As components become obsolete, large BGA rework capability allows for the replacement of end-of-life parts with newer, compatible alternatives.

Rocket EMS’s Large BGA Rework Equipment and Processes

To perform large BGA rework, Rocket EMS has invested in state-of-the-art equipment and developed robust processes to ensure high-quality results. The company’s large BGA rework setup includes:

1. Automated BGA rework systems: These systems, such as the APR-5000-XLS from Air-Vac Engineering, offer precise control over the rework process, ensuring consistent and reliable results. Key features include:
2. Automatic component alignment using high-resolution cameras
3. Programmable heating profiles for optimal solder joint formation
4. Closed-loop temperature control for accurate and repeatable heating

5. Advanced vision systems for pre- and post-rework inspection

6. Solder paste printing systems: Precise solder paste deposition is critical for successful BGA rework. Rocket EMS utilizes high-precision solder paste printers, such as the MY700 from Mycronic, to ensure accurate and consistent solder paste application.

7. X-ray inspection systems: X-ray inspection is essential for verifying the integrity of BGA solder joints, which are hidden beneath the component. Rocket EMS employs advanced X-ray inspection systems, such as the Nikon XT V 160, to perform non-destructive evaluation of BGA solder joints.

8. Trained and certified technicians: Rocket EMS’s technicians are trained and certified in large BGA rework techniques, ensuring that they have the skills and knowledge necessary to perform complex rework operations.

9. Documented processes and quality control: To maintain consistency and quality, Rocket EMS has developed detailed process documents and quality control procedures for large BGA rework. These documents cover all aspects of the rework process, from component removal to final inspection.

Large BGA Rework Process Overview

The large BGA rework process at Rocket EMS involves several key steps:

1. Component removal: The faulty BGA component is removed using the automated rework system. The system heats the component and PCB to the appropriate temperature profile, then lifts the component off the board using a vacuum nozzle.

2. Site preparation: After component removal, the rework site is cleaned and prepared for the new component. This involves removing any residual solder, cleaning the pads, and applying new solder paste using the solder paste printing system.

3. Component placement: The new BGA component is placed on the prepared site using the automated rework system. The system aligns the component with the pads using high-resolution cameras and places it with high accuracy.

4. Reflow soldering: The PCB is heated according to the appropriate reflow profile, melting the solder paste and forming solder joints between the BGA component and the PCB pads. The automated rework system controls the heating process to ensure optimal solder joint formation.

5. Inspection: After reflow soldering, the reworked area is inspected using X-ray imaging to verify the integrity of the solder joints. Visual inspection is also performed to check for any surface defects or alignment issues.

6. Testing: Finally, the reworked PCB undergoes functional testing to ensure that it meets performance specifications and operates as intended.

Benefits of Rocket EMS’s Large BGA Rework Services

By offering large BGA rework services, Rocket EMS provides its customers with several key benefits:

1. Cost savings: Large BGA rework allows for the repair and reuse of PCBs that would otherwise be scrapped, reducing material costs and minimizing waste.

2. Faster turnaround times: With in-house large BGA rework capability, Rocket EMS can perform rework operations quickly, reducing lead times and getting products to market faster.

3. Improved product reliability: By using advanced equipment and proven processes, Rocket EMS ensures that reworked PCBs meet the highest quality standards, resulting in improved product reliability.

4. Flexibility: Large BGA rework capability enables Rocket EMS to support a wide range of customer needs, from prototype development to production ramp-up and post-sales support.

5. Expertise: Rocket EMS’s trained and certified technicians have the knowledge and experience necessary to perform complex large BGA rework operations, giving customers confidence in the quality of the work performed.

Case Studies

Rocket EMS has successfully applied its large BGA rework capability to support customers in various industries. Some notable examples include:

1. Aerospace: A leading aerospace company required rework of a complex PCB containing a large BGA FPGA. Rocket EMS successfully removed the faulty component and replaced it with a new one, enabling the customer to meet tight project deadlines.

2. Medical: A medical device manufacturer needed to replace an obsolete BGA component on a legacy product. Rocket EMS sourced a compatible replacement and performed the rework, extending the life of the product and ensuring continued support for end-users.

3. Industrial: An industrial automation company discovered a manufacturing defect affecting a large number of PCBs. Rocket EMS performed large BGA rework on the affected boards, allowing the company to recover the materials and avoid costly scrap.

Frequently Asked Questions (FAQ)

1. Q: What is the maximum size of BGA components that Rocket EMS can rework?
   A: Rocket EMS’s large BGA rework equipment can handle components up to 55mm x 55mm with ball counts exceeding 2,500.

2. Q: How long does a typical large BGA rework operation take?
   A: The duration of a large BGA rework operation depends on factors such as the size and complexity of the component, the rework site preparation required, and the reflow profile. On average, a single large BGA rework can take between 30 minutes to 2 hours.

3. Q: Can Rocket EMS perform large BGA rework on RoHS-compliant PCBs?
   A: Yes, Rocket EMS is fully equipped to handle large BGA rework on RoHS-compliant PCBs, using lead-free solder paste and appropriate reflow profiles.

4. Q: What industries does Rocket EMS serve with its large BGA rework services?
   A: Rocket EMS serves customers in a wide range of industries, including aerospace, defense, medical, industrial, automotive, and telecommunications.

5. Q: How can I request a quote for large BGA rework services from Rocket EMS?
   A: To request a quote, visit the Rocket EMS website and fill out the contact form, providing details about your project and rework requirements. A Rocket EMS representative will contact you to discuss your needs and provide a customized quote.

Conclusion

The addition of large BGA rework capability to Rocket EMS’s service offerings represents a significant milestone in the company’s commitment to providing comprehensive electronics manufacturing services. With advanced equipment, skilled technicians, and robust processes, Rocket EMS is well-positioned to support customers in their most challenging BGA rework needs.

As the electronics industry continues to evolve, with increasingly complex and miniaturized devices, the importance of large BGA rework capability will only grow. Rocket EMS is proud to be at the forefront of this technology, helping its customers bring innovative products to market faster, more reliably, and more cost-effectively.

For more information about Rocket EMS’s large BGA rework services, visit www.rocketems.com or contact a sales representative today.