What is FEX Tape? FEX Tape is a highly advanced, wear-resistant tape made from cross-linked fluororesin. This unique material combines the exceptional properties of fluoropolymers with the enhanced durability achieved through cross-linking. The result is a tape that exhibits outstanding resistance to wear, abrasion, chemicals, heat, and weathering. Key Features of FEX Tape Feature Description […]
Introduction YINCAE Advanced Materials, LLC, a leading manufacturer of high-performance adhesives and materials, has developed a revolutionary cryogenic die attach material that can withstand temperatures as low as -273°C without delamination. This groundbreaking development has the potential to transform various industries, including aerospace, quantum computing, and scientific research, where ultra-low temperature applications are crucial. Request […]
Introduction Rogers Corporation, a global leader in engineered materials solutions, has released a new waterproof flexible heater substrate designed specifically for flex heater applications. This innovative product, named the ARLON® WaterShed™ Series, offers superior moisture resistance and flexibility compared to traditional heater substrates, making it ideal for use in a wide range of industries and […]
Introduction to BGA Rework Ball Grid Array (BGA) is a surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, […]
Overview of the Flexible Electronics Market Flexible electronics, also known as flex circuits, are electronic devices that are built on flexible substrates such as plastic, paper, or fabric. These devices can be bent, rolled, or stretched without losing their functionality. The use of flexible substrates allows for the creation of lightweight, thin, and conformable electronic […]
Saki Corporation Achieves Milestone with IPC-CFX Certification Saki Corporation, a leading manufacturer of automated optical inspection (AOI) and X-ray inspection (AXI) equipment for the electronics assembly industry, has announced that its inspection systems have achieved IPC-CFX certification. This certification demonstrates Saki’s commitment to open standards and interoperability in electronics manufacturing. What is IPC-CFX? IPC-CFX, which […]
Introduction to PCB Tolerances Printed circuit board (PCB) tolerances refer to the acceptable range of variation in the dimensions and properties of a PCB. Maintaining tight tolerances is critical for ensuring the proper fit, function, and reliability of the finished board and the overall electronic device. San Francisco Circuits, a leading provider of high-quality PCBs, […]
Semiconductor Equipment Sales Forecast According to recent industry reports, the global semiconductor equipment market is expected to experience a compound annual growth rate (CAGR) of approximately 8% between 2020 and 2024. This impressive growth will see the market value rise from an estimated $433.5 billion in 2020 to over $500 billion by 2024. Year Projected […]
Introduction In a significant development for the electronics design industry, SnapEDA, a leading provider of electronic component models, has announced the integration of its vast library with Zuken’s eCADSTAR PCB design software. This integration marks a major milestone in the partnership between SnapEDA and Zuken, aimed at streamlining the design process and enhancing productivity for […]
Introduction Siemens, a global technology powerhouse, has recently unveiled PCBflow, a groundbreaking solution designed to streamline the Design for Manufacturing (DFM) handoff process for printed circuit boards (PCBs). This innovative tool promises to revolutionize the PCB industry by enhancing collaboration between design and manufacturing teams, ultimately reducing time-to-market and improving overall product quality. Request PCB […]
