Introduction to PCB Pads PCB pads, also known as land patterns or footprints, are the exposed metal surfaces on a printed circuit board (PCB) where electronic components are soldered. They provide electrical and mechanical connections between the component leads and the copper traces on the PCB. Pads come in various Read more…
What is PCB tombstoning? PCB tombstoning, also known as chip lifting or Manhattan effect, is a defect that occurs during the reflow soldering process of surface mount components on printed circuit boards (PCBs). It is characterized by one end of a component lifting off the pad, while the other end Read more…
What are PCB pads? PCB pads, also known as solder pads or landing pads, are conductive areas on a printed circuit board where electronic components are soldered. These pads provide a surface for the component leads or pins to be attached, enabling electrical connectivity between the component and the PCB Read more…
Introduction to PCB Manufacturing in China and the US Printed Circuit Board (PCB) manufacturing is a critical industry that underpins modern electronics. Both China and the United States are major players in the global PCB market, but there are significant differences between the two countries in terms of manufacturing capabilities, Read more…
What is PCB Panel Utilization and Why is it Important? PCB panel utilization refers to maximizing the usable area on a manufactured panel of printed circuit boards. A panel is a large board consisting of multiple individual PCBs that are fabricated together and then separated into the final individual boards Read more…
What is BGA Rework? BGA (Ball Grid Array) rework refers to the process of removing and replacing BGA components from printed circuit boards (PCBs). BGA components are integrated circuits or chips that have an array of solder balls on the bottom for connection to the PCB, rather than pins. BGA Read more…
What is BGA Assembly? Ball Grid Array (BGA) assembly is a high-density packaging technology used in the manufacturing of electronic devices. BGA assemblies consist of a substrate with a grid of solder balls on the bottom surface, which are used to connect the package to a printed circuit board (PCB). Read more…
Introduction to Micro-BGA PCB Assembly Micro-BGA (Ball Grid Array) is a type of surface-mount packaging used for integrated circuits (ICs) with a high pin count and small footprint. This packaging technology has gained popularity in recent years due to the increasing demand for miniaturization and high-density interconnects in electronic devices. Read more…
Introduction to Multilayer PCB Manufacturing Multilayer PCBs (Printed Circuit Boards) are essential components in modern electronic devices, offering increased functionality and performance in a compact form factor. The manufacturing process of multilayer PCBs involves several intricate steps that require precision and expertise. In this comprehensive guide, we will delve into Read more…
Introduction to MicroVia PCB Technology Microvia PCB technology has revolutionized the world of printed circuit boards (PCBs) by offering a solution for high-density interconnects and miniaturization. As electronic devices continue to shrink in size while increasing in functionality, microvia PCBs have become an essential component in modern electronics manufacturing. This Read more…