What are PCB pads? PCB pads, also known as solder pads or landing pads, are conductive areas on a printed circuit board where electronic components are soldered. These pads provide a surface for the component leads or pins to be attached, enabling electrical connectivity between the component and the PCB Read more…
What are Castellated Pads? Castellated pads, also known as castellated holes or castellations, are a type of surface mount technology (SMT) used in printed circuit board (PCB) design. These pads are essentially plated through-holes (PTHs) that are cut in half along the edge of the PCB, creating a series of Read more…
What to Look for in a PCB Manufacturer When evaluating PCB Manufacturers, there are several key factors to consider: Capabilities – What types of PCBs can they manufacture? This includes things like max number of layers, material options, min trace/space widths, hole sizes, surface finishes, etc. Pricing – How competitive Read more…
What is PCB Panel Utilization and Why is it Important? PCB panel utilization refers to maximizing the usable area on a manufactured panel of printed circuit boards. A panel is a large board consisting of multiple individual PCBs that are fabricated together and then separated into the final individual boards Read more…
What is BGA Rework? BGA (Ball Grid Array) rework refers to the process of removing and replacing BGA components from printed circuit boards (PCBs). BGA components are integrated circuits or chips that have an array of solder balls on the bottom for connection to the PCB, rather than pins. BGA Read more…
Understanding BGA Packages Before diving into the reballing process, it’s essential to understand what a BGA package is and why it’s used in electronic devices. What is a BGA Package? A BGA package is a type of surface-mount packaging used for integrated circuits (ICs) that utilizes a grid of solder Read more…
What is a DSBGA Package? A Die-Size Ball Grid Array (DSBGA) is a type of surface-mount package designed for high-density, high-performance applications. It is characterized by its small form factor, with the package size being nearly the same as the die size of the integrated circuit (IC) it houses. DSBGAs Read more…
Introduction to Micro-BGA PCB Assembly Micro-BGA (Ball Grid Array) is a type of surface-mount packaging used for integrated circuits (ICs) with a high pin count and small footprint. This packaging technology has gained popularity in recent years due to the increasing demand for miniaturization and high-density interconnects in electronic devices. Read more…
What is BGA Assembly? Ball Grid Array (BGA) assembly is a high-density packaging technology used in the manufacturing of electronic devices. BGA assemblies consist of a substrate with a grid of solder balls on the bottom surface, which are used to connect the package to a printed circuit board (PCB). Read more…
Leading Electronics Manufacturing Services Provider Expands BGA Rework Services Rocket EMS, a top provider of electronics manufacturing services, has announced the addition of large BGA (ball grid array) rework capability to its service offerings. This expansion allows Rocket EMS to perform complex rework on PCBs with large BGA components, meeting Read more…