Henkel Introduces Semiconductor Capillary Underfill for Cutting-Edge Silicon Node Flip Chip Applications

Introduction to Semiconductor Capillary Underfill In the fast-paced world of semiconductor packaging, flip chip technology has emerged as a dominant force, enabling the development of high-performance, compact electronic devices. As the industry continues to push the boundaries of silicon node sizes, the demand for advanced materials that can keep pace Read more…

Hypersen Releases Its Coaxial 3D Line Confocal Sensor to Offer High-Precision 3D Inspection Solution

Introduction to Hypersen’s Coaxial 3D Sensor Hypersen, a leading provider of high-precision 3D inspection solutions, has recently released its latest innovation in the field of 3D sensing technology: the Coaxial 3D Line Confocal Sensor. This cutting-edge sensor is designed to revolutionize the way industries approach quality control, offering unparalleled accuracy Read more…

DuPont to Introduce Epoxy-Based Pyralux HP Laminate Adhesive System at IPC APEX EXPO 2022

What is Pyralux HP? Pyralux HP is a state-of-the-art epoxy-based laminate adhesive system developed by DuPont. This innovative solution is designed to provide superior performance and reliability in electronics packaging applications, particularly in the production of flexible and rigid-flex printed circuit boards (PCBs). The Pyralux HP system consists of a Read more…

All About PCB Panelization

What is PCB Panelization? PCB Panelization, also known as PCB array packaging, is the process of grouping multiple printed circuit board (PCB) designs onto a single panel for production. This method is commonly used to increase manufacturing efficiency and reduce costs by allowing several PCBs to be fabricated and assembled Read more…

DownStream Technologies’ New Software Releases Support Flex, Rigid Flex and Embedded Component Designs

Introduction DownStream Technologies, a leading provider of PCB post-processing solutions, has recently announced significant updates to its suite of CAM and engineering software products. The latest releases offer enhanced support for flex, rigid-flex, and embedded component designs, addressing the growing demand for advanced PCB technologies in various industries. The company’s Read more…