PCBA
Kuprion Introduces ActiveCopper Filled Thermal Vias for Enhanced Heat & Power Dissipation
Introduction to Kuprion’s ActiveCopper Technology Kuprion, a leading innovator in advanced materials and thermal management solutions, has recently unveiled its groundbreaking ActiveCopper filled thermal vias. This cutting-edge technology aims to revolutionize heat and power dissipation in electronic devices, offering superior performance and reliability compared to traditional thermal management methods. What Read more…