Isola to Showcase Circuit Materials for Different Circuit Applications at TPCA 2024 in Taipei

Isola’s Commitment to Quality and Innovation With a strong focus on research and development, Isola has consistently delivered cutting-edge solutions for the electronics industry. The company’s dedication to quality and innovation has earned them a reputation as a trusted partner for designers and manufacturers worldwide. Wide Range of Circuit Materials Read more…

Kuprion Introduces ActiveCopper Filled Thermal Vias for Enhanced Heat & Power Dissipation

Introduction to Kuprion’s ActiveCopper Technology Kuprion, a leading innovator in advanced materials and thermal management solutions, has recently unveiled its groundbreaking ActiveCopper filled thermal vias. This cutting-edge technology aims to revolutionize heat and power dissipation in electronic devices, offering superior performance and reliability compared to traditional thermal management methods. What Read more…

Kinetic Vision Beating COVID-19 Challenges by Collaborating with Altium 365

Introduction: Kinetic Vision’s Innovative Solutions in the Face of a Global Pandemic The COVID-19 pandemic has presented unprecedented challenges for businesses across all industries, forcing them to adapt quickly and find innovative solutions to maintain operations and stay competitive. Kinetic Vision, a leading provider of product design, development, and manufacturing Read more…

Semiconductor Industry Leaders Announce the Formation of UCIe to Standardize Chiplet Ecosystem

Introduction to UCIe and Chiplet Standardization In a groundbreaking move, leading semiconductor companies have joined forces to establish the Universal Chiplet Interconnect Express (UCIe), a consortium aimed at standardizing the chiplet ecosystem. This collaboration brings together industry giants with the goal of creating a unified and interoperable chiplet interconnect standard, Read more…

MacDermid Alpha Launches Ultra-Low Temperature Adhesive for Temperature Sensitive Parts

New Adhesive Bonds at -40°C, Opening Up New Applications for Electronics Assembly MacDermid Alpha Electronics Solutions, a world leader in specialty materials for electronics assembly, has announced the launch of its latest innovation: ALPHA OM-301, an Ultra-Low Temperature Adhesive designed for bonding heat-sensitive components in electronic devices. This revolutionary new Read more…