Flex PCB Material and Layer Stackup

Understanding Flex PCB Materials Polyimide (PI) Substrate Polyimide (PI) is the most commonly used substrate material for flex PCBs. It offers excellent thermal stability, mechanical strength, and electrical insulation properties. PI substrates are available in various thicknesses, typically ranging from 12.5 μm to 125 μm. The choice of thickness depends Read more…

Guides for 10-Layer PCB Stack-up

Introduction to PCB Stack-up A printed circuit board (PCB) stack-up refers to the arrangement of copper layers and insulating materials that make up a PCB. The stack-up determines the electrical properties, signal integrity, and manufacturability of the board. As technology advances and designs become more complex, multi-layer PCBs have become Read more…