Introduction to Micro-BGA PCB Assembly Micro-BGA (Ball Grid Array) is a type of surface-mount packaging used for integrated circuits (ICs) with a high pin count and small footprint. This packaging technology has gained popularity in recent years due to the increasing demand for miniaturization and high-density interconnects in electronic devices. Read more…
What is BGA Assembly? Ball Grid Array (BGA) assembly is a high-density packaging technology used in the manufacturing of electronic devices. BGA assemblies consist of a substrate with a grid of solder balls on the bottom surface, which are used to connect the package to a printed circuit board (PCB). Read more…
Leading Electronics Manufacturing Services Provider Expands BGA Rework Services Rocket EMS, a top provider of electronics manufacturing services, has announced the addition of large BGA (ball grid array) rework capability to its service offerings. This expansion allows Rocket EMS to perform complex rework on PCBs with large BGA components, meeting Read more…
Overview of the Global PCB Market The global printed circuit board (PCB) market has been experiencing steady growth in recent years, driven by the increasing demand for electronic devices across various industries. In Q1 2023, the PCB market continued to show resilience despite the ongoing challenges posed by the COVID-19 Read more…
Introduction to Rogers 4003 PCB Material Rogers 4003 is a high-performance printed circuit board (PCB) material known for its excellent electrical properties, low dielectric constant, and low dissipation factor. This material is widely used in high-frequency applications, such as wireless communications, aerospace, and defense industries. The unique properties of Rogers Read more…
What is Solder Wicking? Solder wicking, also known as capillary action, is a phenomenon that occurs when molten solder is drawn up into the small spaces between connector leads or component pins during the soldering process. This effect is caused by the surface tension of the liquid solder and the Read more…
Flexibility and Reconfigurability One of the main benefits of FPGAs is their flexibility and reconfigurability. Unlike ASICs, which are designed for a specific application and cannot be modified once manufactured, FPGAs can be reprogrammed and reconfigured as needed, even after deployment. This allows designers to update the functionality of their Read more…
Understanding PCB Safe Distance and Its Importance When designing and manufacturing printed circuit boards (PCBs), it is crucial to consider the safe distance between various components, traces, and layers. This distance, known as the PCB safe distance, helps ensure the proper functioning, reliability, and longevity of the PCB. In this Read more…
Introduction to Chip Capacitors Chip capacitors, also known as multilayer ceramic capacitors (MLCCs), are essential components in modern electronic devices. These tiny, surface-mounted devices are used for a variety of purposes, including filtering, decoupling, and energy storage. With the increasing demand for smaller, more efficient electronic devices, the importance of Read more…