What is a DSBGA Package? A Die-Size Ball Grid Array (DSBGA) is a type of surface-mount package designed for high-density, high-performance applications. It is characterized by its small form factor, with the package size being nearly the same as the die size of the integrated circuit (IC) it houses. DSBGAs Read more…
Introduction to Micro-BGA PCB Assembly Micro-BGA (Ball Grid Array) is a type of surface-mount packaging used for integrated circuits (ICs) with a high pin count and small footprint. This packaging technology has gained popularity in recent years due to the increasing demand for miniaturization and high-density interconnects in electronic devices. Read more…
What is BGA Assembly? Ball Grid Array (BGA) assembly is a high-density packaging technology used in the manufacturing of electronic devices. BGA assemblies consist of a substrate with a grid of solder balls on the bottom surface, which are used to connect the package to a printed circuit board (PCB). Read more…
Overview of the Global PCB Market The global printed circuit board (PCB) market has been experiencing steady growth in recent years, driven by the increasing demand for electronic devices across various industries. In Q1 2023, the PCB market continued to show resilience despite the ongoing challenges posed by the COVID-19 Read more…
Introduction to Rogers 4003 PCB Material Rogers 4003 is a high-performance printed circuit board (PCB) material known for its excellent electrical properties, low dielectric constant, and low dissipation factor. This material is widely used in high-frequency applications, such as wireless communications, aerospace, and defense industries. The unique properties of Rogers Read more…
Introduction to SMD Welding Surface-mount device (SMD) welding, also known as surface-mount technology (SMT) welding, is a critical process in the manufacturing of electronic devices. SMD components are small, leadless components that are soldered directly onto the surface of a printed circuit board (PCB). This technology has revolutionized the electronics Read more…
What is an SMT Chip? SMT stands for Surface Mount Technology. An SMT chip, also known as a surface mount device (SMD), is an electronic component that is designed to be mounted directly onto the surface of a printed circuit board (PCB). Unlike through-hole components that require leads to be Read more…
Introduction to Wave Soldering and PTH Components Wave soldering is a widely used technique for soldering through-hole (PTH) components onto printed circuit boards (PCBs). This process involves passing the PCB over a molten solder wave, which creates a reliable electrical and mechanical connection between the components and the board. PTH Read more…
What is Solder Wicking? Solder wicking, also known as capillary action, is a phenomenon that occurs when molten solder is drawn up into the small spaces between connector leads or component pins during the soldering process. This effect is caused by the surface tension of the liquid solder and the Read more…
Flexibility and Reconfigurability One of the main benefits of FPGAs is their flexibility and reconfigurability. Unlike ASICs, which are designed for a specific application and cannot be modified once manufactured, FPGAs can be reprogrammed and reconfigured as needed, even after deployment. This allows designers to update the functionality of their Read more…