What is Innerlayer Imaging in PCB Manufacturing? Innerlayer imaging, also known as primary imaging, is a critical step in the manufacturing process for multilayer printed circuit boards (PCBs). It involves transferring the circuit patterns onto the inner copper layers of the board before laminating them together into the final multilayer Read more…
What is a White PCB? A white PCB, also known as a solder mask white PCB or a white solder mask PCB, is a type of printed circuit board (PCB) that features a white solder mask coating instead of the more common green color. The solder mask is a protective Read more…
What is BGA Soldering? BGA soldering is a method of attaching electronic components, such as microprocessors and memory chips, to a PCB using an array of small solder balls. These solder balls are arranged in a grid pattern on the bottom of the component package, allowing for a high number Read more…
Introduction to High-Voltage PCB Design High-voltage printed circuit boards (PCBs) are essential components in various applications, including power supplies, industrial control systems, and medical equipment. Designing high-voltage PCBs requires careful consideration of several factors to ensure reliable performance, safety, and longevity. In this article, we will explore the key aspects Read more…
Understanding the Basics of Solder Flux What is Solder Flux? Solder flux is a chemical compound that is applied to the surfaces being soldered to improve the wetting and bonding characteristics of the solder. It helps to remove oxides, contaminants, and impurities from the metal surfaces, allowing the molten solder Read more…
What are Microvias? Microvias are small holes drilled in a PCB to make electrical connections between layers. They are typically defined as blind vias (connecting an outer layer to an inner layer) or buried vias (connecting inner layers) with a diameter of 150 μm or less. Some key characteristics of Read more…
What Causes Tin Whiskers? Several factors contribute to the growth of tin whiskers: Stress in the Tin Plating Tin plating on electronic components can experience stress due to various reasons, such as: Temperature fluctuations Mechanical stress during manufacturing or handling Residual stress from the plating process When the stress in Read more…
Introduction to PCB Stackup A printed circuit board (PCB) stackup refers to the arrangement of copper and insulating layers that make up a PCB. The stackup defines the number of layers, their order, and the materials used in the fabrication process. A well-designed PCB stackup ensures proper functionality, signal integrity, Read more…
Definition and Basic Concept Aspect Ratio is expressed as a ratio of two numbers, typically in the format of width:height. For example, a common aspect ratio in photography and digital displays is 16:9, which means that for every 16 units of width, there are 9 units of height. This ratio Read more…
Why Use Blind Vias in PCB Design? There are several reasons why blind vias are used in PCB design: 1. Space Savings One of the main advantages of using blind vias is that they save space on the PCB. Since blind vias do not go all the way through the Read more…