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What is Pyralux HP? Pyralux HP is a state-of-the-art epoxy-based laminate adhesive system developed by DuPont. This innovative solution is designed to provide superior performance and reliability in electronics packaging applications, particularly in the production of flexible and rigid-flex printed circuit boards (PCBs). The Pyralux HP system consists of a high-performance epoxy adhesive that is used to bond copper foil to a variety of substrate materials, including polyimide, polyester, and flexible circuit materials. The adhesive Read more…

Introduction to Hypersen’s Coaxial 3D Sensor Hypersen, a leading provider of high-precision 3D inspection solutions, has recently released its latest innovation in the field of 3D sensing technology: the Coaxial 3D Line Confocal Sensor. This cutting-edge sensor is designed to revolutionize the way industries approach quality control, offering unparalleled accuracy and efficiency in 3D measurement and inspection processes. The Coaxial 3D Line Confocal Sensor is a testament to Hypersen’s commitment to delivering state-of-the-art solutions that Read more…

The Need for EMI Shielding in 5G Devices As 5G technology continues to evolve, electronic devices are becoming increasingly complex, with higher frequencies and more compact designs. These factors contribute to a greater susceptibility to EMI, which can significantly impact device performance and user experience. EMI shielding is crucial in preventing electromagnetic waves from interfering with the device’s internal components and ensuring that the device does not emit excessive electromagnetic radiation that could interfere with Read more…

Introduction to Semiconductor Capillary Underfill In the fast-paced world of semiconductor packaging, flip chip technology has emerged as a dominant force, enabling the development of high-performance, compact electronic devices. As the industry continues to push the boundaries of silicon node sizes, the demand for advanced materials that can keep pace with these innovations has never been greater. Henkel, a global leader in adhesive technologies, has recently introduced a groundbreaking semiconductor capillary underfill solution designed specifically Read more…

InPlan Update Brings Enhanced Features and Improved Performance Frontline, a leading provider of PCB engineering solutions, has recently released a new version of their flagship product, InPlan. This update brings a host of new features and improvements that aim to streamline the PCB design process and enhance the overall user experience. What’s New in InPlan? The latest version of InPlan includes several notable updates and enhancements, including: Improved User Interface: The user interface has been Read more…

What is PCB Design Software? PCB design software is used to create the designs for printed circuit boards (PCBs). PCBs are the foundation of all modern electronics. They are flat boards made of insulating materials like fiberglass, with conductive copper traces printed on them to connect various electronic components. All electronic devices we use today, from smartphones and laptops to medical devices and aerospace systems, have PCBs inside them. Designing the layout of these PCBs Read more…

What is PCB Panelization? PCB Panelization, also known as PCB array packaging, is the process of grouping multiple printed circuit board (PCB) designs onto a single panel for production. This method is commonly used to increase manufacturing efficiency and reduce costs by allowing several PCBs to be fabricated and assembled simultaneously. Panelization is particularly beneficial for high-volume production runs, as it minimizes handling and setup time while maximizing the utilization of materials and equipment. By Read more…

Introduction to RayMing and PCB Substrates RayMing, a leading manufacturer of high-quality printed circuit board (PCB) substrates, has recently announced its involvement in the development of the world’s smallest Bluetooth module. By providing the PCB substrate for this groundbreaking technology, RayMing has solidified its position as a key player in the electronics industry. What are PCB Substrates? PCB substrates are the foundation upon which electronic components are mounted and connected to create a functional circuit Read more…

Introduction to Pyralux AG Flexible Circuit Materials DuPont, a global leader in advanced materials and technologies, has recently introduced its new Pyralux AG flexible circuit materials designed specifically for high-volume manufacturing. These innovative materials offer a range of benefits that make them an ideal choice for various applications in the electronics industry. What are Flexible Circuit Materials? Flexible circuit materials, also known as flex circuits or flexible printed circuit boards (PCBs), are a type of Read more…

Introduction DownStream Technologies, a leading provider of PCB post-processing solutions, has recently announced significant updates to its suite of CAM and engineering software products. The latest releases offer enhanced support for flex, rigid-flex, and embedded component designs, addressing the growing demand for advanced PCB technologies in various industries. The company’s flagship products, including CAM350, BluePrint-PCB, and DFMStream, have been upgraded with new features and capabilities that streamline the design and manufacturing processes for complex PCB Read more…