Blog

What are PCB pads? PCB pads, also known as solder pads or landing pads, are conductive areas on a printed circuit board where electronic components are soldered. These pads provide a surface for the component leads or pins to be attached, enabling electrical connectivity between the component and the PCB traces. Key Features of PCB Pads Conductivity: PCB pads are made of conductive materials, typically copper, to ensure efficient electrical connectivity. Size and Shape: Pads Read more…

What is PCB tombstoning? PCB tombstoning, also known as chip lifting or Manhattan effect, is a defect that occurs during the reflow soldering process of surface mount components on printed circuit boards (PCBs). It is characterized by one end of a component lifting off the pad, while the other end remains soldered, resulting in a tilted appearance resembling a tombstone. Tombstoning can lead to poor electrical connections, reduced mechanical strength, and potential short circuits, compromising Read more…

Introduction to PCB Pads PCB pads, also known as land patterns or footprints, are the exposed metal surfaces on a printed circuit board (PCB) where electronic components are soldered. They provide electrical and mechanical connections between the component leads and the copper traces on the PCB. Pads come in various shapes, sizes, and configurations to accommodate different types of components and mounting techniques. Types of PCB Pads There are several types of PCB pads, each Read more…

Leading Electronics Manufacturing Services Provider Expands BGA Rework Services Rocket EMS, a top provider of electronics manufacturing services, has announced the addition of large BGA (ball grid array) rework capability to its service offerings. This expansion allows Rocket EMS to perform complex rework on PCBs with large BGA components, meeting the evolving needs of its customers in the aerospace, defense, medical, and industrial sectors. What is BGA Rework? BGA rework involves removing and replacing BGA Read more…

What is BGA Assembly? Ball Grid Array (BGA) assembly is a high-density packaging technology used in the manufacturing of electronic devices. BGA assemblies consist of a substrate with a grid of solder balls on the bottom surface, which are used to connect the package to a printed circuit board (PCB). This packaging method allows for a high number of interconnections in a small area, making it ideal for complex, high-performance electronic devices. Advantages of BGA Read more…

Introduction to Micro-BGA PCB Assembly Micro-BGA (Ball Grid Array) is a type of surface-mount packaging used for integrated circuits (ICs) with a high pin count and small footprint. This packaging technology has gained popularity in recent years due to the increasing demand for miniaturization and high-density interconnects in electronic devices. Micro-BGA PCB assembly requires specialized equipment and expertise to ensure reliable and efficient assembly processes. In this article, we will explore the various aspects of Read more…

What is a DSBGA Package? A Die-Size Ball Grid Array (DSBGA) is a type of surface-mount package designed for high-density, high-performance applications. It is characterized by its small form factor, with the package size being nearly the same as the die size of the integrated circuit (IC) it houses. DSBGAs utilize a grid of solder balls on the bottom of the package to establish electrical connections with the PCB. The key features of DSBGA packages Read more…

Understanding BGA Packages Before diving into the reballing process, it’s essential to understand what a BGA package is and why it’s used in electronic devices. What is a BGA Package? A BGA package is a type of surface-mount packaging used for integrated circuits (ICs) that utilizes a grid of solder balls to connect the IC to the printed circuit board (PCB). The solder balls are arranged in a grid pattern on the bottom side of Read more…

What is BGA Rework? BGA (Ball Grid Array) rework refers to the process of removing and replacing BGA components from printed circuit boards (PCBs). BGA components are integrated circuits or chips that have an array of solder balls on the bottom for connection to the PCB, rather than pins. BGA rework is often necessary to replace defective components, upgrade chips, or modify circuit boards. BGA rework requires specialized equipment and expertise due to the complex Read more…

What is PCB Panel Utilization and Why is it Important? PCB panel utilization refers to maximizing the usable area on a manufactured panel of printed circuit boards. A panel is a large board consisting of multiple individual PCBs that are fabricated together and then separated into the final individual boards after manufacturing. Optimizing panel utilization is critical for several reasons: Cost reduction: Manufacturing PCBs in panels allows you to produce a higher quantity of boards Read more…